Modeling of voids/cracks and their interactions

Yang, Chunhui and Soh, A. 2002, Modeling of voids/cracks and their interactions, Theoretical and applied fracture mechanics, vol. 38, no. 1, pp. 81-101.

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Title Modeling of voids/cracks and their interactions
Author(s) Yang, Chunhui
Soh, A.
Journal name Theoretical and applied fracture mechanics
Volume number 38
Issue number 1
Start page 81
End page 101
Publisher Elsevier Science Publishers B.V.
Place of publication Amsterdam, Netherlands
Publication date 2002-07
ISSN 0167-8442
1872-7638
Keyword(s) circular/elliptical hole
crack
semi-analytic element
hybrid element
complex potentials
conformal mapping
Summary Numerical modeling of a two-dimensional elastic body containing multiple voids/cracks to study the interaction between these defects can be  significantly simplified by developing special finite elements, each containing an internal circular/elliptic hole or a slit crack. These finite elements are developed using complex potentials and the conformal mapping technique. The elements developed can be divided into two categories, namely, the semi-analytic-type and hybrid-type elements. The latter element type is an improved version of the former due to the implementation of displacement continuity along the inter-element boundary. All the proposed elements can be easily combined with the conventional displacement elements, such as isoparametric elements, to analyze the above-mentioned problems without using complicated finite element meshes. Numerical examples have been employed to illustrate the modeling of voids/cracks and their interactions. The results obtained using the semi-analytic-type elements are in good agreement with the theoretical results, and the corresponding results obtained using the hybrid-type elements show an improvement of the agreement with the theoretical results. However, the former element type is much easier to construct.
Language eng
Field of Research 090506 Structural Engineering
HERDC Research category C1.1 Refereed article in a scholarly journal
Copyright notice ©2002, Elsevier Science Ltd.
Persistent URL http://hdl.handle.net/10536/DRO/DU:30004402

Document type: Journal Article
Collection: School of Engineering and Information Technology
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