Melding : a new alternative to adhesive bonding

Corbett, Tim, Forrest, Mark, Law, Haydn and Fox, Bronwyn L. 2005, Melding : a new alternative to adhesive bonding, in SAMPE Europe 2005 : Proceedings of the 26th International SAMPE Europe Conference : Nanotechnology Assists Leadership and Success of the Composite Technology, SAMPE Europe Business Office, Nuglar, Switzerland, pp. 105-110.

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Title Melding : a new alternative to adhesive bonding
Author(s) Corbett, Tim
Forrest, Mark
Law, Haydn
Fox, Bronwyn L.
Conference name International SAMPE Europe Conference (26th : 2005 : Paris, France)
Conference location Paris, France
Conference dates 5-7 April 2005
Title of proceedings SAMPE Europe 2005 : Proceedings of the 26th International SAMPE Europe Conference : Nanotechnology Assists Leadership and Success of the Composite Technology
Editor(s) Drechsler, K.
Publication date 2005
Start page 105
End page 110
Publisher SAMPE Europe Business Office
Place of publication Nuglar, Switzerland
Summary Melding, a novel method for joining composites is examined in this paper. The method uses Quickstep ™ technology to retain partially cured areas of a composite laminate, enabling subsequent bonding operations. The effect of melding on the mechanical properties of the composite has been investigated. Flexural testing of HexPly 914 indicates consistent properties throughout a melded section. Flexural strength values of 1.36±O.03 GPa compared to 1.35±O.03 GPa for a standard laminate were recorded. In order to achieve sufficient bond strength, the portion of the composite to be joined must have a significant proportion of uncured matrix. The ability of Hexply 914 prepreg to retain sufficient bonding potential to form a strong joint was also investigated. HexPly 914 Lap Shear results indicated no significant variation in strength values between co-cured and melded joins, with a recorded
strength value of 15.0±0. 7 MPa.
ISBN 3952267732
9783952267738
Language eng
Field of Research 091202 Composite and Hybrid Materials
HERDC Research category E2 Full written paper - non-refereed / Abstract reviewed
Copyright notice ©2005, SAMPE Europe
Persistent URL http://hdl.handle.net/10536/DRO/DU:30014403

Document type: Conference Paper
Collection: School of Engineering and Technology
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