Effects of deformation-induced heating on bond strength of rolled metal multilayer

Yang, Dengke, Hodgson, Peter and Wen, Cui'e 2010, Effects of deformation-induced heating on bond strength of rolled metal multilayer, Materials science forum, vol. 654-656, pp. 2579-2582, doi: 10.4028/www.scientific.net/MSF.654-656.2579.

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Title Effects of deformation-induced heating on bond strength of rolled metal multilayer
Author(s) Yang, Dengke
Hodgson, Peter
Wen, Cui'e
Journal name Materials science forum
Volume number 654-656
Start page 2579
End page 2582
Total pages 4
Publisher Trans Tech Publications
Place of publication Stafa-Zurich
Publication date 2010-06-30
ISSN 0255-5476
1422-6375
Keyword(s) roll bonding
bond strength
thermal conductivity
oxide film
Summary The bond strength of various metal multilayers produced by cold rolling of metal foils with different thermal conductivity was investigated. Results indicated that under the same conditions of deformation and surface preparation, the metallic multilayer system with low thermal conductivity exhibited relative high bond strength while high thermal conductivity metal system may fail to be roll-bonded together. The relationship between the deformation-induced localized heating and the bond strength were discussed. The deformation-induced localized heating in the low thermal conductivity metal multilayer systems may provide opportunities for achieving a successful accumulative roll bonding or a “cold roll/heat treatment/cold roll” process to synthesize metallic multilayer materials.
Language eng
DOI 10.4028/www.scientific.net/MSF.654-656.2579
Field of Research 091207 Metals and Alloy Materials
Socio Economic Objective 970109 Expanding Knowledge in Engineering
HERDC Research category C1 Refereed article in a scholarly journal
HERDC collection year 2010
Copyright notice ©(2010), Trans Tech Publications, Switzerland
Persistent URL http://hdl.handle.net/10536/DRO/DU:30030453

Document type: Journal Article
Collections: Centre for Material and Fibre Innovation
GTP Research
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