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Simulations of stress–strain heterogeneities in copper thin films : texture and substrate effects

Siska, Filip, Forest, Samuel and Gumbsch, Peter 2007, Simulations of stress–strain heterogeneities in copper thin films : texture and substrate effects, Computational materials science, vol. 39, no. 1, pp. 137-141, doi: 10.1016/j.commatsci.2006.02.025.

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Title Simulations of stress–strain heterogeneities in copper thin films : texture and substrate effects
Author(s) Siska, Filip
Forest, Samuel
Gumbsch, Peter
Journal name Computational materials science
Volume number 39
Issue number 1
Start page 137
End page 141
Publisher Elsevier BV
Place of publication Aedermannsdorf, Switzerland
Publication date 2007-03
ISSN 0927-0256
Keyword(s) finite elements
crystal plasticity
polycrystals
thin films
Language eng
DOI 10.1016/j.commatsci.2006.02.025
Field of Research 091307 Numerical Modelling and Mechanical Characterisation
091308 Solid Mechanics
Socio Economic Objective 970109 Expanding Knowledge in Engineering
HERDC Research category C1.1 Refereed article in a scholarly journal
ERA Research output type C Journal article
Copyright notice ©2006, Elsevier B.V.
Persistent URL http://hdl.handle.net/10536/DRO/DU:30039166

Document type: Journal Article
Collection: Centre for Material and Fibre Innovation
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