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Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish

Bui, Q. V., Nam, N. D., Yoon, J. W., Choi, D. H., Kar, A., Kim, J. G. and Jung, S. B. 2011, Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish, Journal of electronic materials, vol. 40, no. 9, pp. 1937-1942, doi: 10.1007/s11664-011-1682-1.

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Title Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish
Author(s) Bui, Q. V.
Nam, N. D.
Yoon, J. W.
Choi, D. H.
Kar, A.
Kim, J. G.
Jung, S. B.
Journal name Journal of electronic materials
Volume number 40
Issue number 9
Start page 1937
End page 1942
Total pages 6
Publisher Springer New York LLC
Place of publication New York, N. Y.
Publication date 2011-09
ISSN 0361-5235
1543-186X
Keyword(s) electronic materials
NiP
gold
corrosion resistance
Summary The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.
Language eng
DOI 10.1007/s11664-011-1682-1
Field of Research 099999 Engineering not elsewhere classified
Socio Economic Objective 970109 Expanding Knowledge in Engineering
HERDC Research category C1.1 Refereed article in a scholarly journal
Copyright notice ©2011, TMS
Persistent URL http://hdl.handle.net/10536/DRO/DU:30048007

Document type: Journal Article
Collection: Institute for Frontier Materials
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