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Preparation of silica abrasives from water glass and application in silicon wafer polishing

Hu, X.K., Song, Z.T., Wang, H.B., Liu, W.L., Qin, F. and Zhang, Z.F. 2010, Preparation of silica abrasives from water glass and application in silicon wafer polishing, Advanced materials research, vol. 92, pp. 183-187, doi: 10.4028/www.scientific.net/AMR.92.183.

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Title Preparation of silica abrasives from water glass and application in silicon wafer polishing
Author(s) Hu, X.K.
Song, Z.T.
Wang, H.B.
Liu, W.L.
Qin, F.
Zhang, Z.F.
Journal name Advanced materials research
Volume number 92
Start page 183
End page 187
Total pages 5
Publisher Trans Tech Publications
Place of publication Stafa-Zurich, Switzerland
Publication date 2010
ISSN 1022-6680
Keyword(s) abrasives
CMP
polymerization
silica
water glass
Summary Chemical mechanical polishing technique is more frequently adopted for planarization in integrated circuit fabrication. The silica abrasives in colloidal state are fabricated with the sodium silicate solution as raw materials through the polymerization reaction among silicic acid molecules. By continuous injection of silicic acid into the preexisting silica solution, the diameter of silica nanoparticles increases. The different sized silica nanoparticles are imaged by scanning electron microscopy, and the dried silica are characterized by X-ray diffraction and thermal analysis. The polishing test on silicon wafer with as-fabricated silica abrasives shows that the surface flatness reaches 1.1 nm roughness, however, micro scratches are still present in the surface.
Language eng
DOI 10.4028/www.scientific.net/AMR.92.183
Field of Research 039999 Chemical Sciences not elsewhere classified
Socio Economic Objective 970103 Expanding Knowledge in the Chemical Sciences
HERDC Research category C1.1 Refereed article in a scholarly journal
Persistent URL http://hdl.handle.net/10536/DRO/DU:30052745

Document type: Journal Article
Collection: Institute for Frontier Materials
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