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Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

Hu, XiaoKai, Song, Zhitang, Pan, Zhongcai, Liu, Weili and Wu, LiangCai 2009, Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives, Applied surface science, vol. 255, no. 19, pp. 8230-8234, doi: 10.1016/j.apsusc.2009.05.056.

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Title Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives
Author(s) Hu, XiaoKai
Song, Zhitang
Pan, Zhongcai
Liu, Weili
Wu, LiangCai
Journal name Applied surface science
Volume number 255
Issue number 19
Start page 8230
End page 8234
Total pages 5
Publisher Elsevier
Place of publication Amsterdam, The Netherlands
Publication date 2009-07-15
ISSN 0169-4332
1873-5584
Keyword(s) sapphire
abrasives
grinding
polishing
planarization
silica
Language eng
DOI 10.1016/j.apsusc.2009.05.056
Field of Research 039999 Chemical Sciences not elsewhere classified
Socio Economic Objective 970103 Expanding Knowledge in the Chemical Sciences
HERDC Research category C1.1 Refereed article in a scholarly journal
Persistent URL http://hdl.handle.net/10536/DRO/DU:30052754

Document type: Journal Article
Collection: Institute for Frontier Materials
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