Characterization and optimization to improve uneven surface on MEMS bridge fabrication

Mafinejad,Y, Kouzani,AZ, Nassabi,M, Lim,Y and Mafinezhad,K 2015, Characterization and optimization to improve uneven surface on MEMS bridge fabrication, Displays, vol. 37, pp. 54-61, doi: 10.1016/j.displa.2014.08.004.

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Title Characterization and optimization to improve uneven surface on MEMS bridge fabrication
Author(s) Mafinejad,Y
Kouzani,AZORCID iD for Kouzani,AZ
Journal name Displays
Volume number 37
Start page 54
End page 61
Total pages 8
Publisher Elsevier
Publication date 2015
ISSN 0141-9382
Keyword(s) Dry release
Extra hard bake
RF MEMS bridge
Science & Technology
Physical Sciences
Computer Science, Hardware & Architecture
Engineering, Electrical & Electronic
Instruments & Instrumentation
Computer Science
Summary This paper presents an optimized fabrication method for developing a freestanding bridge for RF MEMS switches. In this method, the sacrificial layer is patterned and hard baked a 220°C for 3min, after filling the gap between the slots of the coplanar waveguide. Measurement results by AFM and SEM demonstrate that this technique significantly improves the planarity of the sacrificial layer, reducing the uneven surface to less than 20nm, and the homogeneity of the Aluminum thickness across the bridge. Moreover, a mixture of O2, Ar and CF4 was used and optimized for dry releasing of the bridge. A large membrane (200×100μm2) was released without any surface bending. Therefore, this method not only simplifies the fabrication process, but also improves the surface flatness and edge smoothness of the bridge. This fabrication method is fully compatible with standard silicon IC technology.
Language eng
DOI 10.1016/j.displa.2014.08.004
Field of Research 091306 Microelectromechanical Systems (MEMS)
Socio Economic Objective 861503 Scientific Instruments
HERDC Research category C1 Refereed article in a scholarly journal
ERA Research output type C Journal article
Copyright notice ©2015, Elsevier
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