On-chip coupled transmission line modeling for millimeter-wave applications using four-port measurements

Kang, Kai, Brinkhoff, James, Shi, Jinglin and Lin, Fujiang 2010, On-chip coupled transmission line modeling for millimeter-wave applications using four-port measurements, IEEE transactions on advanced packaging, vol. 33, no. 1, pp. 153-159, doi: 10.1109/TADVP.2009.2024212.

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Title On-chip coupled transmission line modeling for millimeter-wave applications using four-port measurements
Author(s) Kang, Kai
Brinkhoff, JamesORCID iD for Brinkhoff, James orcid.org/0000-0002-0721-2458
Shi, Jinglin
Lin, Fujiang
Journal name IEEE transactions on advanced packaging
Volume number 33
Issue number 1
Start page 153
End page 159
Total pages 7
Publisher Institute of Electrical and Electronics Engineers
Publication date 2010-02-01
ISSN 1521-3323
Keyword(s) Science & Technology
Technology
Engineering, Manufacturing
Engineering, Electrical & Electronic
Materials Science, Multidisciplinary
Engineering
Materials Science
Complementary metal-oxide semiconductor (CMOS)
coupled transmission lines
equivalent circuit model
four-port deembedding
on-chip measurements
110 GHZ
INTERCONNECTS
SUBSTRATE
SILICON
DESIGN
Language eng
DOI 10.1109/TADVP.2009.2024212
Field of Research 0906 Electrical And Electronic Engineering
0910 Manufacturing Engineering
HERDC Research category CN.1 Other journal article
Persistent URL http://hdl.handle.net/10536/DRO/DU:30086722

Document type: Journal Article
Collection: Faculty of Science, Engineering and Built Environment
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