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Microstructure and properties of Cu–Ti–Ni alloys

Liu, Jia, Wang, Xian-hui, Guo, Ting-ting, Zou, Jun-tao and Yang, Xiao-hong 2015, Microstructure and properties of Cu–Ti–Ni alloys, International journal of minerals, metallurgy and materials, vol. 22, no. 11, pp. 1199-1204, doi: 10.1007/s12613-015-1185-9.

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Title Microstructure and properties of Cu–Ti–Ni alloys
Author(s) Liu, Jia
Wang, Xian-hui
Guo, Ting-ting
Zou, Jun-tao
Yang, Xiao-hong
Journal name International journal of minerals, metallurgy and materials
Volume number 22
Issue number 11
Start page 1199
End page 1204
Total pages 6
Publisher Springer
Place of publication Berlin, Germany
Publication date 2015-11
ISSN 1674-4799
1869-103X
Keyword(s) copper alloys
aging
microstructure
hardness
electrical conductivity
elastic modulus
Language eng
DOI 10.1007/s12613-015-1185-9
Field of Research 099999 Engineering not elsewhere classified
09 Engineering
Socio Economic Objective 0 Not Applicable
HERDC Research category C1.1 Refereed article in a scholarly journal
ERA Research output type C Journal article
Copyright notice ©2015, University of Science and Technology Beijing and Springer
Persistent URL http://hdl.handle.net/10536/DRO/DU:30087008

Document type: Journal Article
Collection: Institute for Frontier Materials
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