Poly(ethylene-co-methacrylic acid) (EMAA) as an efficient healing agent for high performance epoxy networks using diglycidyl ether of bisphenol A (DGEBA) Pingkarawat, K., Dell'Olio, C., Varley, R. J. and Mouritz, A. P. 2016, Poly(ethylene-co-methacrylic acid) (EMAA) as an efficient healing agent for high performance epoxy networks using diglycidyl ether of bisphenol A (DGEBA), Polymer, vol. 92, pp. 153-163, doi: 10.1016/j.polymer.2016.03.054. Attached Files Name Description MIMEType Size Downloads Title Poly(ethylene-co-methacrylic acid) (EMAA) as an efficient healing agent for high performance epoxy networks using diglycidyl ether of bisphenol A (DGEBA) Author(s) Pingkarawat, K. Dell'Olio, C. Varley, R. J. orcid.org/0000-0002-3792-1140 Mouritz, A. P. Journal name Polymer Volume number 92 Start page 153 End page 163 Total pages 11 Publisher Elsevier Place of publication Amsterdam, The Netherlands Publication date 2016-06-01 ISSN 0032-3861 Summary The use of poly(ethylene-co-methacrylic acid) (EMAA) as an efficient and repeatable thermally activated healing agent in a high performance diglycidyl ether of bis phenol A (DGEBA)/diethyl toluene diamine (DETDA) mendable epoxy composite is presented. Despite curing above the melting point of EMAA (Tm = 85 °C), healing was facilitated by incorporating a preliminary low temperature curing step of 5 h at 80 °C, prior to epoxy cure at 150 °C. Healing was subsequently shown to occur at 130 °C, 150 °C and 200 °C via a pressure delivery mechanism derived from a condensation reaction between EMAA and the residual hydroxyl groups formed during epoxy cure. Healing was repeatable over 5 healing cycles despite a gradual reduction in efficiency, while efficiency increased with increasing healing temperature. Importantly, healing was evident at 130 °C, despite the epoxy network remaining in the glassy state at this temperature (Tg = 150-158 °C). As well as creating high performance mendable composites based upon DGEBA/DETDA, EMAA particles distributed evenly on the surface of the crack plane were found to enhance mode I interlaminar fracture toughness by up to 200% for both DETDA and 4,4 diamino diphenyl sulphone (44 DDS) systems. Language eng DOI 10.1016/j.polymer.2016.03.054 Field of Research 099999 Engineering not elsewhere classified Socio Economic Objective 0 Not Applicable HERDC Research category C1 Refereed article in a scholarly journal ERA Research output type C Journal article Copyright notice ©2016, Elsevier Ltd. Persistent URL http://hdl.handle.net/10536/DRO/DU:30089345 Document type: Journal Article Collection: Institute for Frontier Materials Related Links Link Description Connect to published version Go to link with your DU access privileges     Unless expressly stated otherwise, the copyright for items in DRO is owned by the author, with all rights reserved. Versions Version Filter Type Thu, 24 Nov 2016, 14:59:44 EST Fri, 25 Nov 2016, 04:03:32 EST Wed, 22 Mar 2017, 05:04:55 EST Wed, 19 Apr 2017, 15:44:31 EST Wed, 19 Apr 2017, 15:46:12 EST Sat, 18 Nov 2017, 01:39:08 EST Filtered Full Citation counts:   Cited 4 times in TR Web of Science Cited 4 times in Scopus Search Google Scholar Access Statistics: 169 Abstract Views, 1 File Downloads  -  Detailed Statistics Created: Thu, 24 Nov 2016, 14:59:44 EST

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