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Tungsten/steel diffusion bonding using Cu/W–Ni/Ni multi-interlayer

YANG, Zong-hui, SHEN, Yi-fu, Wang, Zhi-yang and CHENG, Jia-ling 2014, Tungsten/steel diffusion bonding using Cu/W–Ni/Ni multi-interlayer, Transactions of Nonferrous Metals Society of China, vol. 24, no. 8, pp. 2554-2558, doi: 10.1016/S1003-6326(14)63382-3.

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Title Tungsten/steel diffusion bonding using Cu/W–Ni/Ni multi-interlayer
Author(s) YANG, Zong-hui
SHEN, Yi-fu
Wang, Zhi-yang
CHENG, Jia-ling
Journal name Transactions of Nonferrous Metals Society of China
Volume number 24
Issue number 8
Start page 2554
End page 2558
Total pages 5
Publisher Elsevier
Place of publication Amsterdam, The Netherlands
Publication date 2014-08
ISSN 1003-6326
Keyword(s) tungsten
diffusion bonding
sintering
interlayer
Language eng
DOI 10.1016/S1003-6326(14)63382-3
Field of Research 091207 Metals and Alloy Materials
0914 Resources Engineering And Extractive Metallurgy
Socio Economic Objective 970110 Expanding Knowledge in Technology
HERDC Research category C1.1 Refereed article in a scholarly journal
Copyright notice ©2014, The Nonferrous Metals Society of China
Persistent URL http://hdl.handle.net/10536/DRO/DU:30093851

Document type: Journal Article
Collection: Institute for Frontier Materials
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