An analysis of springback with bifurcation behavior and its application to die design Kim, JB, Yoon, Jeong Whan and Yang, DY 2008, An analysis of springback with bifurcation behavior and its application to die design, in 9th International Conference on Technology of Plasticity, ICTP 2008, International Centre for Theoretical Physics,, pp. 1455-1460. Title An analysis of springback with bifurcation behavior and its application to die design Author(s) Kim, JB Yoon, Jeong Whan orcid.org/0000-0002-7616-5253 Yang, DY Conference location Gyeongju, Korea Conference dates 2011/09/07 - 2011/09/11 Title of proceedings 9th International Conference on Technology of Plasticity, ICTP 2008 Publication date 2008 Start page 1455 End page 1460 Total pages 6 Publisher International Centre for Theoretical Physics HERDC Research category EN.1 Other conference paper Persistent URL http://hdl.handle.net/10536/DRO/DU:30096675 Document type: Conference Paper Collections: Faculty of Science, Engineering and Built Environment School of Engineering Related Links Link Description   Unless expressly stated otherwise, the copyright for items in DRO is owned by the author, with all rights reserved. Versions Version Filter Type Wed, 17 May 2017, 14:04:38 EST Thu, 18 May 2017, 05:03:22 EST Thu, 21 Sep 2017, 06:19:39 EST Thu, 24 May 2018, 13:38:56 EST Thu, 24 May 2018, 13:40:20 EST Filtered Full Citation counts:   Cited 0 times in TR Web of Science Cited 0 times in Scopus Search Google Scholar Access Statistics: 17 Abstract Views  -  Detailed Statistics Created: Wed, 17 May 2017, 14:04:38 EST

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