An analysis of springback with bifurcation behavior and its application to die design

Kim, JB, Yoon, Jeong Whan and Yang, DY 2008, An analysis of springback with bifurcation behavior and its application to die design, in 9th International Conference on Technology of Plasticity, ICTP 2008, International Centre for Theoretical Physics,, pp. 1455-1460.


Title An analysis of springback with bifurcation behavior and its application to die design
Author(s) Kim, JB
Yoon, Jeong WhanORCID iD for Yoon, Jeong Whan orcid.org/0000-0002-7616-5253
Yang, DY
Conference location Gyeongju, Korea
Conference dates 2011/09/07 - 2011/09/11
Title of proceedings 9th International Conference on Technology of Plasticity, ICTP 2008
Publication date 2008
Start page 1455
End page 1460
Total pages 6
Publisher International Centre for Theoretical Physics
HERDC Research category EN.1 Other conference paper
Persistent URL http://hdl.handle.net/10536/DRO/DU:30096675

Document type: Conference Paper
Collection: School of Engineering
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