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A review on carbon based materials as on-chip interconnects

conference contribution
posted on 2024-10-10, 04:27 authored by H Sadeghi, JM Redouté, Daniel LaiDaniel Lai, MT Ahmadi, R Ismail
A review on carbon based materials as on-chip interconnects

History

Volume

8204

Location

AUSTRALIA, Melbourne

Start date

2011-12-05

End date

2011-12-07

ISSN

0277-786X

Language

English

Publication classification

E1.1 Full written paper - refereed

Editor/Contributor(s)

Juodkazis S, Gu M

Title of proceedings

Proceedings of SPIE - The International Society for Optical Engineering

Event

Conference on Smart Nano-Micro Materials and Devices/SPIE Smart Nano + Micro Materials and Devices Forum

Publisher

SPIE-INT SOC OPTICAL ENGINEERING

Series

Proceedings of SPIE