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An ensemble deep learning architecture for multilabel classification on TI-RADS

conference contribution
posted on 2021-01-13, 00:00 authored by Xueli Duan, Shaobo Duan, Pei Jiang, Runzhi Li, Ye Zhang, Jingzhe Ma, Hongling Zhao, Honghua Dai
In recent years, thyroid nodule is being one of the most common nodular lesions. Ultrasonography is widely used in the clinical diagnosis of thyroid nodules. With the development of artificial intelligence, there emerge great progress in medical image diagnosis. Clinically, physician diagnose malignant or benign by many pathological features. In this work, we propose an ensemble architecture to resolve multi-label problem, which integrate three methods to extract features on thyroid nodule for ultrasound images. They are EfficientNet, feature engineering and feature pyramid network. We consider five kinds of pathological features quantified by Thyroid Imaging Report and Data System (TI-RADS). In the experiments, we use two datasets. One includes 587 original ultrasound images on thyroid nodules collected from the local health physical center of a 3A hospital. The other is a public dataset in the MICCAI 2020 competition. It contains 3644 ultrasound images of thyroid images. We use receiver operating characteristic curve (ROC) to evaluate the model, the area under curve (AUC) on every kind of features. The experimental results show that the proposed method can effectively assist doctors in diagnosing ultrasound images of thyroid nodules.

History

Pagination

576-582

Location

Virtual Event via Seoul, South Korea

Start date

2020-12-16

End date

2020-12-19

ISBN-13

9781728162157

Language

eng

Publication classification

E1 Full written paper - refereed

Copyright notice

2020, IEEE

Editor/Contributor(s)

Park T, Cho Y-R, Hu X, Yoo I, Woo HG, Wang J, Facelli J, Nam S, Kang M

Title of proceedings

BIBM 2020 : Preceedings of IEEE International Conference on Bioinformatics and Biomedicine

Event

BIBM 2020 IEEE Bioinformatics and Biomedicine. International Conference (Virtual Event via Seoul, South Korea))

Publisher

Institute of Electrical and Electronics Engineers

Place of publication

Piscataway, N.J.

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