The radial return mapping algorithm within the computational context of a hybrid Finite Element and Particle-In-Cell (FE/PIC) method is constructed to allow a fluid flow FE/PIC code to be applied solid mechanic problems with large displacements and large deformations. The FE/PIC method retains the robustness of an Eulerian mesh and enables tracking of material deformation by a set of Lagrangian particles or material points. In the FE/PIC approach the particle velocities are interpolated from nodal velocities and then the particle position is updated using a suitable integration scheme, such as the 4th order Runge-Kutta scheme[1]. The strain increments are obtained from gradients of the nodal velocities at the material point positions, which are then used to evaluate the stress increment and update history variables. To obtain the stress increment from the strain increment, the nonlinear constitutive equations are solved in an incremental iterative integration scheme based on a radial return mapping algorithm[2]. A plane stress extension of a rectangular shape J2 elastoplastic material with isotropic, kinematic and combined hardening is performed as an example and for validation of the enhanced FE/PIC method. It is shown that the method is suitable for analysis of problems in crystal plasticity and metal forming. The method is specifically suitable for simulation of neighbouring microstructural phases with different constitutive equations in a multiscale material modelling framework.
History
Event
World Congress on Computational Mechanics (7th : 2006 : Los Angeles, Calif.)
Publisher
[World Congress on Computational Mechanics]
Location
Los Angeles, Calif.
Place of publication
[Los Angeles, Calif.]
Start date
2006-07-16
End date
2006-07-22
Language
eng
Publication classification
E2 Full written paper - non-refereed / Abstract reviewed
Editor/Contributor(s)
W Liu, J Chen
Title of proceedings
Proceedings of the 7th World Congress of Computational Mechanics on Computational Bridging of Length Scales in Complex Materials, Los Angeles, California, 20–21 July 2006