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CO2 laser machining of fully packaged autonomous microfluidic systems

Version 2 2024-06-06, 11:28
Version 1 2017-08-03, 10:07
conference contribution
posted on 2024-06-06, 11:28 authored by MI Mohammed, MPY Desmulliez
In this article we demonstrate a simple yet robust CO 2 -laser etching rapid prototyping technique for the construction of autonomous microfluidic capillary systems. The final packaging of the microfluidic device is demonstrated using both thermal and adhesive based lamination bonding and allows for a turnaround time of approximately 30 minutes to 3 hours from activation of the laser system to device use. The low-cost CO 2 laser system is capable of producing repeatable microfluidic structures with minimum feature sizes superior than 100-150μm over channel depths of more than 150μm. This system is utilised to create capillary pump and valve designs within poly(methyl methacrylate) (PMMA) substrates. Such components are utilised to create advanced systems that can self initiate and maintain the flow of various volumes of fluids from an input to a collection reservoir, whilst also controlling the progression of the flow through the various simple and advanced valve type structures demonstrated. Such systems could prove a very useful alternative to traditional, non-integrated, fluidic actuation and flow control systems found on-chip, which generally require some form of energy input, have limited portable capabilities and require more complex fabrication procedures.

History

Pagination

1-8

Location

Cannes, France

Start date

2012-04-25

End date

2012-04-27

ISBN-13

9781467307857

Language

eng

Publication classification

E Conference publication, E1.1 Full written paper - refereed

Copyright notice

2012, EDA Publishing/DTIP

Editor/Contributor(s)

[Unknown]

Title of proceedings

DTIP 2012 : Proceedings of the 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Event

IEEE Components, Packaging and Manufacturing Technology Society. Conference (2012 : Cannes, France)

Publisher

Institute of Electrical and Electronics Engineers

Place of publication

Piscataway, N.J.

Series

IEEE Components, Packaging and Manufacturing Technology Society Conference

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