Designing for Microbreaks: Unpacking the Design Journey of Zenscape
Version 2 2024-06-06, 01:56
Version 1 2022-04-08, 08:29
conference contribution
posted on 2024-06-06, 01:56 authored by RA Khot, JYL Yi, Deepti AggarwalDeepti AggarwalDesigning for Microbreaks: Unpacking the Design Journey of Zenscape
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Pagination
1-16Location
Daejeon, South KoreaOpen access
- Yes
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Start date
2022-02-13End date
2022-02-16ISBN-13
9781450391474Language
engPublication classification
E1.1 Full written paper - refereedTitle of proceedings
TEI2022: Proceedings of the 16th International Conference on Tangible, Embedded, and Embodied InteractionEvent
TEI: Tangible, Embedded, and Embodied Interaction. International Conference (16th: 2022: Daejeon, South Korea)Publisher
Association for Computing Machinery (ACM)Place of publication
New York, N.Y.Usage metrics
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