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DynaCool: Efficient cooling of next-generation large-scale data centers

Version 2 2024-06-03, 02:59
Version 1 2024-04-11, 06:58
conference contribution
posted on 2024-06-03, 02:59 authored by N Gowdra, Roopak SinhaRoopak Sinha
DynaCool: Efficient cooling of next-generation large-scale data centers

History

Volume

2017-January

Pagination

5420-5425

Location

Beijing, China

Publisher DOI

Start date

2017-10-29

End date

2017-11-01

ISSN

1553-572X

ISBN-13

9781538611272

Language

eng

Publication classification

E1.1 Full written paper - refereed

Title of proceedings

IECON 2017 : Proceedings of the 43rd Annual Conference of the IEEE Industrial Electronics Society

Event

Industrial Electronics Society. Conference (2017 : 43rd : Beijing, China)

Publisher

IEEE

Place of publication

Piscataway, N.J.

Series

IEEE Industrial Electronics Society

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    Categories

    Keywords

    EngineeringEngineering, Electrical & ElectronicEngineering, IndustrialScience & TechnologySYSTEMSTechnology

    Licence

    All Rights Reserved

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