PVD TiN hardmask for copper metallization

Xie, Zhigang; Bodke, Ashish; Fu, Jianming; Jauhari, Rahul; Abdelrahman, Magdy

PVD TiN hardmask for copper metallization

conference contribution

posted on 2023-06-23, 05:33 authored by Zhigang Xie, Ashish Bodke, Jianming Fu, Rahul Jauhari, Magdy Abdelrahman

PVD TiN hardmask for copper metallization

History

Pagination

419-421

Location

Santa Clara, Calif.

Publisher DOI

https://doi.org/10.1109/ISSM.2007.4446856

Start date

2007-10-15

End date

2007-10-17

ISSN

1523-553X

ISBN-13

978-1-4244-1141-2

Language

English

Publication classification

E1.1 Full written paper - refereed

Title of proceedings

ISSM 2007 : Proceedings of the International Symposium on Semiconductor Manufacturing 2007

Event

International Symposium on Semiconductor Manufacturing. (2007 : Santa Clara, Calif.)

Publisher

IEEE

Place of publication

Piscataway, N.J.

Publication URL

https://doi-org.ezproxy-f.deakin.edu.au/10.1109/ISSM.2007.4446856

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Keywords

Engineering Engineering, Electrical & Electronic Materials Science Materials Science, Multidisciplinary Science & Technology Technology TECHNOLOGY

PVD TiN hardmask for copper metallization

History

Pagination

Location

Publisher DOI

Start date

End date

ISSN

ISBN-13

Language

Publication classification

Title of proceedings

Event

Publisher

Place of publication

Publication URL

Usage metrics

Categories

Keywords

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