Wetting characteristics of Al-containing Sn-1Ag-0.5Cu solder alloy on Cu substrate using wetting balance and spread area methods
conference contribution
posted on 2023-02-03, 02:49 authored by Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said, Dhafer Abdulameer ShnawahWetting characteristics of Al-containing Sn-1Ag-0.5Cu solder alloy on Cu substrate using wetting balance and spread area methods
History
Volume
20Pagination
9-14Location
AUSTRALIA, GeelongPublisher DOI
Start date
2015-06-29End date
2015-07-01ISSN
2212-0173Language
EnglishPublication classification
E1.1 Full written paper - refereedEditor/Contributor(s)
Littlefair G, Gibson I, Usma C, Collins P, Hilditch TTitle of proceedings
PROCEEDINGS OF THE 1ST INTERNATIONAL DESIGN TECHNOLOGY CONFERENCE, DESTECH2015Event
Proceedings of The 1st International Design Technology Conference, DESTECH2015Publisher
ELSEVIER SCIENCE BVSeries
Procedia TechnologyPublication URL
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Science & TechnologyTechnologyComputer Science, Interdisciplinary ApplicationsComputer Science, Theory & MethodsComputer ScienceSn-1Ag-0.5CuAl additionwetting balance methodspread area methodLEAD-FREE SOLDERAG-CONTENTMICROSTRUCTURAL STABILITYMECHANICAL-PROPERTIESTENSILE PROPERTIESRELIABILITYWT.PERCENTJOINTS
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