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3D-IncNet: Head and Neck (H&N) Primary Tumors Segmentation and Survival Prediction

journal contribution
posted on 2023-02-08, 23:37 authored by A Qayyum, A Benzinou, Imran RazzakImran Razzak, M Mazher, Thanh Thi NguyenThanh Thi Nguyen, D Puig, F Vafaee
Cancer begins when healthy cells change and grow out of control, forming a mass called a tumor. Head and Neck (H&N) cancers usually develop in or around the head and neck, including the mouth (oral cavity), nose and sinuses, throat (pharynx), and voice box (larynx). 4% of all cancers are H&N cancers with a very low survival rate (a five-year survival rate of 64.7%). FDG-PET/CT imaging is often used for early diagnosis and staging of H&N tumors, thus improving these patients' survival rates. This work presents a novel 3D-Inception-Residual aided with 3D depth-wise convolution and squeeze and excitation block. We introduce a 3D depth-wise convolution-inception encoder consisting of an additional 3D squeeze and excitation block and a 3D depth-wise convolution-based residual learning decoder (3D-IncNet), which not only helps to recalibrate the channel-wise features but adaptively through explicit inter-dependencies modeling but also integrate the coarse and fine features resulting in accurate tumor segmentation. We further demonstrate the effectiveness of inception-residual encoder-decoder architecture in achieving better dice scores and the impact of depth-wise convolution in lowering the computational cost. We applied random forest for survival prediction on deep, clinical, and radiomics features. Experiments are conducted on the benchmark HECKTOR21 challenge, which showed significantly better performance by surpassing the state-of-the-artwork and achieved 0.836 and 0.811 concordance index and dice scores, respectively. We made the model and code publicly available 11

https://github.com/RespectKnowledge/HeadandNeck21_3D_Segmentation

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Journal

IEEE Journal of Biomedical and Health Informatics

Volume

PP

Pagination

1-9

ISSN

2168-2194

eISSN

2168-2208

Issue

99

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

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