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Characterization and optimization to improve uneven surface on MEMS bridge fabrication
journal contribution
posted on 2015-01-01, 00:00 authored by Y Mafinejad, Abbas KouzaniAbbas Kouzani, M Nassabi, Yang Lim, K MafinezhadThis paper presents an optimized fabrication method for developing a freestanding bridge for RF MEMS switches. In this method, the sacrificial layer is patterned and hard baked a 220°C for 3min, after filling the gap between the slots of the coplanar waveguide. Measurement results by AFM and SEM demonstrate that this technique significantly improves the planarity of the sacrificial layer, reducing the uneven surface to less than 20nm, and the homogeneity of the Aluminum thickness across the bridge. Moreover, a mixture of O2, Ar and CF4 was used and optimized for dry releasing of the bridge. A large membrane (200×100μm2) was released without any surface bending. Therefore, this method not only simplifies the fabrication process, but also improves the surface flatness and edge smoothness of the bridge. This fabrication method is fully compatible with standard silicon IC technology.
History
Journal
DisplaysVolume
37Pagination
54 - 61Publisher
ElsevierPublisher DOI
ISSN
0141-9382Language
engPublication classification
C Journal article; C1 Refereed article in a scholarly journalCopyright notice
2015, ElsevierUsage metrics
Categories
Keywords
Dry releaseExtra hard bakeFlatnessReflowRF MEMS bridgeSmoothnessScience & TechnologyTechnologyPhysical SciencesComputer Science, Hardware & ArchitectureEngineering, Electrical & ElectronicInstruments & InstrumentationOpticsComputer ScienceEngineeringACTUATION VOLTAGEPHOTORESISTMORPHOLOGIESInformation SystemsArtificial Intelligence and Image Processing
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