Charge transfer evaluation in solid insulating materials encapsulating the gaseous voids of submillimeter dimensions using transmission line method

https://hdl.handle.net/10779/DRO/DU:30351136

journal contribution

posted on 2025-10-14, 01:14 authored by A Shamsi, A Ganjovi, A Shayegani Akmal

Charge transfer evaluation in solid insulating materials encapsulating the gaseous voids of submillimeter dimensions using transmission line method

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1.
DOI - Is version of https://doi.org/10.55730/1300-0632.4040

Open access

Yes

Language

eng

Journal

Turkish Journal Of Electrical Engineering And Computer Sciences

Volume

31

Pagination

1145-1167

ISSN

1300-0632

eISSN

1303-6203

Issue

7

Publisher

Scientific and Technical research Council of Turkey - TUBITAK/Turkiye Bilimsel ve Teknik Arastirma Kurumu

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Keywords

charge transfer Computer Science Computer Science, Artificial Intelligence DIELECTRIC-BARRIER DISCHARGES Engineering Engineering, Electrical & Electronic insulating materials MODEL PLASMA Science & Technology Technology TLM method voids of submillimeter dimensions

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