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Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish

journal contribution
posted on 2011-09-01, 00:00 authored by Q Bui, N Nam, J Yoon, D Choi, A Kar, J Kim, S Jung
The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.

History

Journal

Journal of electronic materials

Volume

40

Issue

9

Pagination

1937 - 1942

Publisher

Springer New York LLC

Location

New York, N. Y.

ISSN

0361-5235

eISSN

1543-186X

Language

eng

Publication classification

C1.1 Refereed article in a scholarly journal

Copyright notice

2011, TMS

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