Effects of aging and thermal cycling on the microstructure and damping behaviors of a porous CuAlMn shape memory alloy
Version 2 2024-06-19, 14:27
Version 1 2022-09-30, 01:05
journal contribution
posted on 2024-06-19, 14:27 authored by Qian Wang, Liwei Wang, Jie Kang, Qingzhou Wang, Chunxiang Cui, Ru Su, Balaji NarayanaswamyEffects of aging and thermal cycling on the microstructure and damping behaviors of a porous CuAlMn shape memory alloy
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Journal of Materials Research and TechnologyVolume
9Pagination
7020-7026ISSN
2238-7854Language
enPublication classification
C1 Refereed article in a scholarly journalIssue
4Publisher
Elsevier BVUsage metrics
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