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Forming in hydrogenated amorphous silicon metal-semiconductor-metal devices using bipolar pulse stressing

Version 2 2024-06-17, 23:08
Version 1 2017-03-11, 23:57
journal contribution
posted on 2024-06-17, 23:08 authored by JO Orwa, SRP Silva, JM Shannon
Because of the ability to deliver large voltage and current transients and limit power dissipation, a single bipolar pulse applied through a series capacitor results in forming at lower voltages with more uniformity compared to unipolar pulses. In addition, the on-resistances following bipolar pulse stressing are more uniform compared to unipolar pulses.

History

Journal

Electronics letters

Volume

41

Pagination

98-100

Location

Piscataway, N.J.

ISSN

0013-5194

Language

eng

Publication classification

C Journal article, C1.1 Refereed article in a scholarly journal

Copyright notice

[2005, The Authors]

Issue

2

Publisher

IEEE