Forming in hydrogenated amorphous silicon metal-semiconductor-metal devices using bipolar pulse stressing
Version 2 2024-06-17, 23:08Version 2 2024-06-17, 23:08
Version 1 2017-03-11, 23:57Version 1 2017-03-11, 23:57
journal contribution
posted on 2024-06-17, 23:08authored byJO Orwa, SRP Silva, JM Shannon
Because of the ability to deliver large voltage and current transients and limit power dissipation, a single bipolar pulse applied through a series capacitor results in forming at lower voltages with more uniformity compared to unipolar pulses. In addition, the on-resistances following bipolar pulse stressing are more uniform compared to unipolar pulses.