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Lamination based embossing technique for LTCC

Version 2 2024-06-13, 09:05
Version 1 2015-08-24, 15:53
journal contribution
posted on 2024-06-13, 09:05 authored by SP Wilhelm, RW Kay, MI Mohammed, Y Lacrotte, MPY Desmulliez
This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.

History

Journal

Microsystem technologies

Volume

19

Pagination

801-807

Location

Berlin, Germany

ISSN

0946-7076

Language

eng

Publication classification

C Journal article, C1.1 Refereed article in a scholarly journal

Copyright notice

2012, Springer Verlag

Issue

6

Publisher

Springer Verlag

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