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Optimization of upcycling of Ti-6Al-4V swarf

Version 2 2024-06-04, 05:25
Version 1 2018-07-12, 15:53
journal contribution
posted on 2024-06-04, 05:25 authored by Y Qi, IB Timokhina, A Shekhter, K Sharp, Rimma LapovokRimma Lapovok
© 2018 Elsevier B.V. Application of Ti alloys in the aerospace and biomedical industries is on the incline which typically results in more than 80% of Ti alloy in swarf. Hence, developing innovative processes to recycle Ti alloys swarf is becoming an increasingly valuable issue. Equal-channel angular pressing (ECAP) compaction with a series of post-deformation heat treatments were designed and investigated in this study as method to upcycle Ti swarf. After a single ECAP compaction process, the compacts possessed near 99% theoretical density and annealing treatment further increased the density and enhanced the bonding between chips. The microstructural and textural evolution of α and β phases after ECAP and annealing was examined. Upcycling of fine-grained Ti-6Al-4V compacts with minimum crystallographic texture intensity were produced from swarf using economically-viable way.

History

Journal

Journal of materials processing technology

Volume

255

Pagination

853-864

Location

Amsterdam, The Netherlands

ISSN

0924-0136

Language

eng

Publication classification

C1 Refereed article in a scholarly journal

Copyright notice

2018, Elsevier B.V.

Publisher

Elsevier