Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

https://hdl.handle.net/10536/DRO/DU:30052754
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journal contribution

posted on 2009-07-15, 00:00 authored by Xiaokai Hu, Z Song, Z Pan, W Liu, L Wu

Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

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Related Materials

1.
DOI - Is version of https://doi.org/10.1016/j.apsusc.2009.05.056

Location

Amsterdam, The Netherlands

Language

eng

Publication classification

C1.1 Refereed article in a scholarly journal

Journal

Applied surface science

Volume

255

Pagination

8230 - 8234

ISSN

0169-4332

eISSN

1873-5584

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Keywords

sapphire abrasives grinding polishing planarization silica

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All Rights Reserved

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