File(s) under permanent embargo
Relating the early evolution of microstructure with the electrochemical response and mechanical performance of a Cu-rich and Cu-lean 7xxx aluminum alloy
Version 2 2024-05-30, 08:29
Version 1 2014-10-28, 10:09
journal contribution
posted on 2024-05-30, 08:29 authored by RK Gupta, A Deschamps, MK Cavanaugh, SP Lynch, Nick BirbilisNick BirbilisRelating the early evolution of microstructure with the electrochemical response and mechanical performance of a Cu-rich and Cu-lean 7xxx aluminum alloy
History
Journal
Journal of the Electrochemical SocietyVolume
159Pagination
C492-C502Location
New York, N.Y.Publisher DOI
ISSN
0013-4651eISSN
1945-7111Language
EnglishPublication classification
C1.1 Refereed article in a scholarly journalIssue
11Publisher
ELECTROCHEMICAL SOC INCUsage metrics
Categories
No categories selectedKeywords
Science & TechnologyPhysical SciencesTechnologyElectrochemistryMaterials Science, Coatings & FilmsMaterials ScienceAL-ZN-MGANGLE X-RAYSTRESS-CORROSION CRACKINGPITTING CORROSIONDYNAMIC PRECIPITATIONINTERMETALLIC PHASESSTOCHASTIC-MODELSSTAINLESS-STEELSVOLUME FRACTIONGRAIN-BOUNDARY091299 Materials Engineering not elsewhere classified091207 Metals and Alloy Materials970109 Expanding Knowledge in Engineering
Licence
Exports
RefWorks
BibTeX
Ref. manager
Endnote
DataCite
NLM
DC