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journal contribution
posted on 2024-07-26, 02:22 authored by Jihong ParkJihong Park, S Samarakoon, M Bennis, M Debbah, A Conti, S Mazuelas, S Bartoletti, WC Lindsey, MZ Win, Y Zhang, J Mao, PM Grant, JS Thompson
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Journal

Proceedings of the IEEE

Volume

107

Pagination

2202-2203

Publisher DOI

ISSN

0018-9219

eISSN

1558-2256

Publication classification

E3.1 Extract of paper

Issue

11

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

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