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Simulations of stress–strain heterogeneities in copper thin films : texture and substrate effects
journal contribution
posted on 2007-03-01, 00:00 authored by Filip Siska, S Forest, P GumbschSimulations of stress–strain heterogeneities in copper thin films : texture and substrate effects
History
Journal
Computational materials scienceVolume
39Issue
1Pagination
137 - 141Publisher
Elsevier BVLocation
Aedermannsdorf, SwitzerlandPublisher DOI
ISSN
0927-0256Language
engPublication classification
C1.1 Refereed article in a scholarly journal; C Journal articleCopyright notice
2006, Elsevier B.V.Usage metrics
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