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Simulations of stress–strain heterogeneities in copper thin films : texture and substrate effects

journal contribution
posted on 2007-03-01, 00:00 authored by Filip Siska, S Forest, P Gumbsch
Simulations of stress–strain heterogeneities in copper thin films : texture and substrate effects

History

Journal

Computational materials science

Volume

39

Issue

1

Pagination

137 - 141

Publisher

Elsevier BV

Location

Aedermannsdorf, Switzerland

ISSN

0927-0256

Language

eng

Publication classification

C1.1 Refereed article in a scholarly journal; C Journal article

Copyright notice

2006, Elsevier B.V.

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