Thermal performance analysis of a microchannel heat sink cooling with copper oxide-indium (CuO/In) nano-suspensions at high-temperatures
Version 2 2024-06-13, 13:49
Version 1 2020-09-23, 14:03
journal contribution
posted on 2024-06-13, 13:49 authored by MM Sarafraz, M ArjomandiThermal performance analysis of a microchannel heat sink cooling with copper oxide-indium (CuO/In) nano-suspensions at high-temperatures
History
Journal
Applied Thermal EngineeringVolume
137Pagination
700-709Location
Amsterdam, The NetherlandsISSN
1359-4311Language
engPublication classification
C1.1 Refereed article in a scholarly journalPublisher
ElsevierUsage metrics
Keywords
Science & TechnologyPhysical SciencesTechnologyThermodynamicsEnergy & FuelsEngineering, MechanicalMechanicsEngineeringLiquid IndiumHeat transfer coefficientCopper oxidePeristaltic flowFriction factorPRESSURE-DROP CHARACTERISTICSSMOOTHED HORIZONTAL CYLINDERDILUTE BINARY-MIXTURESTRANSFER COEFFICIENTWATER NANOFLUIDTRACHEOBRONCHIAL AIRWAYSTHERMODYNAMIC MODELSCUO/WATER NANOFLUIDEXCHANGER WORKINGAL2O3 NANOFLUIDS4012 Fluid mechanics and thermal engineering
Licence
Exports
RefWorks
BibTeX
Ref. manager
Endnote
DataCite
NLM
DC