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Toughening of a trifunctional epoxy system: IV. Dynamic mechanical relaxational study of the thermoplastic-modified cure process

journal contribution
posted on 15.01.1997, 00:00 authored by Russell VarleyRussell Varley, J H Hodgkin, D G Hawthorne, G P Simon
Dynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T g behavior of the epoxy phase. Prereaction of the PSF material with the epoxy resin was found to greatly increase the solubility of the PSF in the epoxy phase with little effect on the concentration of the epoxy monomer dissolving in the PSF phase. The curing behavior of the epoxy component in the thermoplastic phase was also investigated, in addition to changes in the mobility of the network at both gelation and vitrification.

History

Journal

Journal of polymer science part B: polymer physics

Volume

35

Issue

1

Pagination

153 - 163

Publisher

Wiley

Location

Chichester, Eng.

ISSN

0887-6266

Language

eng

Publication classification

C1.1 Refereed article in a scholarly journal

Copyright notice

1997, John Wiley & Sons, Inc.