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Toughening of a trifunctional epoxy system: IV. Dynamic mechanical relaxational study of the thermoplastic-modified cure process
journal contributionposted on 15.01.1997, 00:00 authored by Russell VarleyRussell Varley, J H Hodgkin, D G Hawthorne, G P Simon
Dynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T g behavior of the epoxy phase. Prereaction of the PSF material with the epoxy resin was found to greatly increase the solubility of the PSF in the epoxy phase with little effect on the concentration of the epoxy monomer dissolving in the PSF phase. The curing behavior of the epoxy component in the thermoplastic phase was also investigated, in addition to changes in the mobility of the network at both gelation and vitrification.