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Tungsten/steel diffusion bonding using Cu/W–Ni/Ni multi-interlayer

Version 2 2024-06-17, 21:56
Version 1 2017-04-07, 13:38
journal contribution
posted on 2024-06-17, 21:56 authored by Z-H YANG, Y-F SHEN, Z-Y WANG, J-L CHENG
Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W–10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures, composition distribution and fracture characteristics of the joint were studied by SEM and EDS. Joint properties were evaluated by shear experiments and thermal shock tests. The results showed that the joints comprised tungsten/Cu–Ni sub-layer/W–Ni composites sub-layer/Ni sub-layer/0Cr13Al stainless steel. The W–Ni composites sub-layer with a homogeneous and dense microstructure was formed by solid phase sintering of 90W–10Ni powder mixtures. Sound bonding between tungsten base material and W–Ni composites sub-layer was realized based on transient liquid phase (TLP) diffusion bonding mechanism. Joints fractured at bonding zone of W–Ni composites sub-layer and Ni sub-layer during shear testing, and the average strength was 256 MPa. Thermal shock tests showed that joints could withstood 60 thermal cycles quenching from 700 °C to room temperature.

History

Journal

Transactions of Nonferrous Metals Society of China

Volume

24

Pagination

2554-2558

Location

Amsterdam, The Netherlands

ISSN

1003-6326

Language

eng

Publication classification

C1.1 Refereed article in a scholarly journal

Copyright notice

2014, The Nonferrous Metals Society of China

Issue

8

Publisher

Elsevier